IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9832870 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Jun. 06, 2013

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Hiroaki Kobayashi, Fukushima, JP;

Masanobu Sogame, Tokyo, JP;

Kentaro Nomizu, Tokyo, JP;

Yoshinori Mabuchi, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Christopher Polley

Int. Cl.
CPC ...
B32B 3/10 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/40 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08K 9/02 (2006.01); B32B 5/02 (2006.01); H05K 1/05 (2006.01); C08K 3/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/4014 (2013.01); C08J 5/24 (2013.01); C08K 9/02 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); H05K 1/056 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/304 (2013.01); B32B 2307/306 (2013.01); B32B 2307/5825 (2013.01); B32B 2307/726 (2013.01); B32B 2457/08 (2013.01); C08J 2363/02 (2013.01); C08J 2363/04 (2013.01); C08K 3/14 (2013.01); H05K 1/0353 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/0227 (2013.01); Y10T 428/24893 (2015.01); Y10T 442/2721 (2015.04); Y10T 442/3415 (2015.04); Y10T 442/3423 (2015.04); Y10T 442/656 (2015.04);
Abstract

A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

Find Patent Forward Citations

Loading…