The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Apr. 26, 2016
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Jack Ajoian, Campbell, CA (US);
Padam Jain, Castro Valley, CA (US);
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD., Singapore, SG;
Abstract
A build-up process for fabricating a multi-layer PCB is provided during which a mezzanine redistribution, or routing, structure is formed within one of the PCB dielectric material layers that allows additional electrical interconnections (i.e., traces and crossovers) to be made within that layer, thereby obviating the need to add an additional PCB layer in order to make those interconnections. The mezzanine redistribution structure also can be interconnected with the metal layers that are above and below it to further increase routing complexity and flexibility. The mezzanine redistribution structure can be formed without increasing the total thickness of the PCB and without substantially increasing costs.