The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jun. 30, 2014
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Richard Baisl, Regensburg, DE;

Christoph Kefes, Regensburg, DE;

Michael Popp, Freising, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/44 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 51/448 (2013.01); H01L 51/5253 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); H01L 51/5203 (2013.01); H01L 51/5212 (2013.01); H01L 51/5243 (2013.01); H01L 51/5256 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.


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