The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Mar. 17, 2016
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Eiki Kawano, Kiyosu, JP;

Masayuki Kaneko, Kiyosu, JP;

Norifumi Hattori, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85181 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device includes: a first lead including a first base portion having a constant thickness and a first small-thickness portion having a thickness smaller than that of the first base portion; a second lead including a second base portion having a constant thickness and a second small-thickness portion having a thickness smaller than that of the second base portion; wherein the first small-thickness portion and the second small-thickness portion face each other with a gap interposed therebetween; the length of the gap is 0.9 to 1.2 times the thickness of the edges of the first small-thickness portion and the second small-thickness portion; the length of the bonding wire in a plan view of the light emitting device is smaller than a value obtained by adding the thickness of the base portion, a width of a mounting-disabled area, and a width of a bonding-disabled area.


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