The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jun. 02, 2016
Applicant:

Asahi Glass Company, Limited, Chiyoda-ku, JP;

Inventors:

Makoto Shiratori, Haibara-gun, JP;

Yoko Mitsui, Chiyoda-ku, JP;

Satoshi Takeda, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01); C03C 3/11 (2006.01); C03C 8/24 (2006.01); H01L 33/56 (2010.01); H01L 33/32 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 3/11 (2013.01); C03C 8/24 (2013.01); H01L 33/32 (2013.01); H01L 33/507 (2013.01); H01L 33/56 (2013.01); H01L 2924/16195 (2013.01); H01L 2933/0033 (2013.01);
Abstract

To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO, from 0.5 to 15% of AlO, from 5 to 25% of BO, from 0 to 7% of LiO, from 0 to 15% of NaO, from 0 to 10% of KO (provided LiO+NaO+KO=from 2 to 20%), from 0 to 0.1% of SnOand from 0.001 to 0.1% of FeO, it does not substantially contain AsO, SbOand PbO, and it has an average thermal expansion coefficient of from 45 to 70×10/° C. in a temperature range of from 0 to 300° C.


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