The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831363 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 28, 2017

Filed:

Jun. 19, 2014
Applicant:

John Farah, Attleboro, MA (US);

Inventor:

John Farah, Attleboro, MA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 23/00 (2006.01); H01L 31/0304 (2006.01); H01L 31/18 (2006.01); H01L 31/0687 (2012.01); C30B 33/06 (2006.01); B23K 26/402 (2014.01); B23K 26/082 (2014.01); B23K 26/53 (2014.01); B23K 26/0622 (2014.01); H01L 31/0392 (2006.01); C30B 29/40 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/03046 (2013.01); B23K 26/0624 (2015.10); B23K 26/082 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); C30B 33/06 (2013.01); H01L 31/03926 (2013.01); H01L 31/0687 (2013.01); H01L 31/06875 (2013.01); H01L 31/184 (2013.01); H01L 31/1892 (2013.01); B23K 2203/172 (2015.10); B23K 2203/50 (2015.10); B23K 2203/54 (2015.10); C30B 29/40 (2013.01); Y02E 10/544 (2013.01);
Abstract

An epitaxially grown III-V layer is separated from the growth substrate. The III-V layer can be an inverted lattice matched (ILM) or inverted metamorphic (IMM) solar cell, or a light emitting diode (LED). A sacrificial epitaxial layer is embedded between the GaAs wafer and the III-V layer. The sacrificial layer is damaged by absorbing IR laser radiation. A laser is chosen with the right wavelength, pulse width and power. The radiation is not absorbed by either the GaAs wafer or the III-V layer. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The III-V layer is detached from the growth wafer by propagating a crack through the damaged layer. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new III-V layers, resulting in savings in raw materials and grinding and etching costs.


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