The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Dec. 15, 2016
Applicant:

Ultra Display Technology Corp., Taipei, TW;

Inventor:

Yung-Yu Yen, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 27/12 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/167 (2013.01); H01L 27/1248 (2013.01); H01L 27/1262 (2013.01); H01L 33/62 (2013.01); H01L 2224/83139 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83951 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95136 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1515 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.


Find Patent Forward Citations

Yen, Yung-Yu. (2017). Opto-electronic apparatus and manufacturing method thereof (U.S. Patent No. 9831228). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9831228

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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