The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Dec. 07, 2016
Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;
Baoquan Wu, Shenzhen, CN;
Wei Long, Shenzhen, CN;
Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;
Abstract
The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body. In addition, the multi-chip redistribution technology can also greatly narrow down an interconnection distance between chips, which improves efficiency of communication between chips.