The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Feb. 04, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Kunmo Chu, Seoul, KR;

Wonsuk Chang, Hwaseong-si, KR;

Chanmoon Chung, Wonju-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01B 1/22 (2006.01); H01R 4/04 (2006.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/33 (2013.01); H01B 1/22 (2013.01); H01L 23/5328 (2013.01); H01L 23/53276 (2013.01); H01L 24/09 (2013.01); H01L 24/29 (2013.01); H01R 4/04 (2013.01); H01L 2224/29028 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29394 (2013.01); H01L 2224/29691 (2013.01); H01L 2224/32227 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/0134 (2013.01); H01L 2924/1426 (2013.01); H01R 13/2414 (2013.01);
Abstract

Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.


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