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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831192 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

May. 13, 2016

Cavity formation in semiconductor devices

Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

David T. Petzold, Chelmsford, MA (US);

David Scott Whitefield, Andover, MA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:

Chang & Hale LLP

Primary Examiner:

Ganiyu A Hanidu

Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 23/66 (2006.01); H03H 9/24 (2006.01); H01L 21/764 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H04B 1/40 (2015.01); H01L 21/306 (2006.01); H01L 23/535 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H04B 1/44 (2006.01); H01L 21/683 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/30604 (2013.01); H01L 21/6835 (2013.01); H01L 21/764 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 21/76898 (2013.01); H01L 21/84 (2013.01); H01L 23/5283 (2013.01); H01L 23/535 (2013.01); H01L 23/66 (2013.01); H01L 27/1203 (2013.01); H01L 28/10 (2013.01); H01L 29/0649 (2013.01); H01L 29/66772 (2013.01); H01L 29/78 (2013.01); H01L 29/786 (2013.01); H03H 9/24 (2013.01); H04B 1/40 (2013.01); H04B 1/44 (2013.01); H01L 23/3121 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/16 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01);
Abstract

Fabricating of radio-frequency (RF) devices involve providing a field-effect transistor (FET) formed over an oxide layer formed on a semiconductor substrate, removing at least part of the semiconductor substrate to expose at least a portion of a backside of the oxide layer, applying a sacrificial material to the backside of the oxide layer, applying an interface material to at least a portion of the backside of the oxide layer, the interface material at least partially covering the sacrificial material, and removing at least a portion of the sacrificial material to form a cavity at least partially covered by the interface layer.

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