The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Mar. 02, 2016
Applicant:
Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;
Inventor:
Hirofumi Harada, Chiba, JP;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 23/525 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5258 (2013.01); H01L 24/00 (2013.01);
Abstract
A semiconductor integrated circuit device includes a fuse element that can be laser trimmed to adjust the characteristics of the semiconductor integrated circuit device, The semiconductor integrated circuit device includes an interlayer insulating film above the fuse element, and the thickness of the interlayer insulating film is reduced by using an amorphous silicon layer that is formed by sputtering as a material of the fuse element, and by forming the amorphous silicon layer at the same time as metal wiring is formed. The laser trimming processing is thus stabilized without needing a high level of dry etching stabilization control.