The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Apr. 19, 2016
Applicant:

Infineon Technologies Americas Corp., El Segundo, CA (US);

Inventors:

Eung San Cho, Torrance, CA (US);

Darryl Galipeau, Warwick, RI (US);

Danny Clavette, Greene, RI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 27/06 (2006.01); H01L 29/16 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4853 (2013.01); H01L 23/495 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/40 (2013.01); H01L 27/0617 (2013.01); H01L 29/16 (2013.01); H02M 7/003 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/181 (2013.01);
Abstract

In one implementation, a semiconductor package includes a control transistor and a sync transistor of a power converter switching stage attached over a first patterned conductive carrier, as well as a magnetic material situated over leads of the first patterned conductive carrier. The semiconductor package also includes a second patterned conductive carrier attached over the first patterned conductive carrier, the control and sync transistors, and the magnetic material. Leads of the second patterned conductive carrier overlie the magnetic material and are coupled to the leads of the first patterned conductive carrier so as to form windings of an output inductor for the power converter switching stage, the output inductor being integrated into the semiconductor package.


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