The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Aug. 28, 2013
Applicant:

Qubeicon Ltd., Rishon LeZion, IL;

Inventor:

Shimon Podval, Rishon LeZion, IL;

Assignee:

QUBEICON LTD., Rishon LeZion, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/49855 (2013.01); H01L 25/0655 (2013.01); H05K 1/0204 (2013.01); H05K 1/117 (2013.01); H05K 1/141 (2013.01); H05K 3/3442 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81385 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15162 (2013.01); H01L 2924/15192 (2013.01); H05K 3/3415 (2013.01); H05K 2201/041 (2013.01); H05K 2201/0939 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/09472 (2013.01); Y02P 70/613 (2015.11);
Abstract

A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.


Find Patent Forward Citations

Quick Actions:

Podval, Shimon. (2017). Semiconductor die and package jigsaw submount (U.S. Patent No. 9831144). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9831144

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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