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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9829791 B1

PDFFull Text
Expired
Date of Patent:
Nov. 28, 2017

Filed:

Sep. 29, 2014

Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kenichi Iwashita, Tokyo, JP;

Tetsuya Kato, Tokyo, JP;

Masahiko Ebihara, Tokyo, JP;

Yasuharu Murakami, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01); H05K 3/28 (2006.01); G03F 7/004 (2006.01); H05K 3/06 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); G03F 7/0047 (2013.01); G03F 7/0382 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H05K 3/287 (2013.01); H05K 3/064 (2013.01); H05K 3/1258 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.

Find Patent Forward Citations

Iwashita, Kenichi. (2017). Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern (U.S. Patent No. 9829791). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9829791

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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