The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Dec. 28, 2012
Applicant:
Naoki Masuda, Tokyo, JP;
Inventor:
Naoki Masuda, Tokyo, JP;
Assignee:
NEC DISPLAY SOLUTIONS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 21/16 (2006.01); H01S 5/024 (2006.01); H05K 7/20 (2006.01); G03B 21/20 (2006.01); H01S 5/022 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
G03B 21/16 (2013.01); G03B 21/204 (2013.01); G03B 21/2013 (2013.01); H01S 5/02469 (2013.01); H01S 5/02476 (2013.01); H05K 7/20409 (2013.01); G03B 21/208 (2013.01); H01L 2924/0002 (2013.01); H01S 5/02212 (2013.01); H01S 5/4025 (2013.01);
Abstract
A structure for cooling a semiconductor element includes an element body and a lead terminal extending from one surface of the element body in a direction intersecting the one surface. The semiconductor element cooling structure includes a heat sink. The heat sink includes a contact surface that is in contact with the one surface of the element body, a through-hole which is formed in the contact surface and through which the lead terminal passes, and a space portion that communicates with the through-hole and that is configured to house a substrate connected to the lead terminal.