The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Dec. 16, 2016
Applicant:

Syndiant Inc., Dallas, TX (US);

Inventors:

Chun Chiu Daniel Wong, Dallas, TX (US);

Hiap Liew Ong, Dallas, TX (US);

Assignee:

SYNDIANT INC., Dallas, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1337 (2006.01); G02F 1/1335 (2006.01); G02F 1/1341 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133723 (2013.01); G02F 1/1341 (2013.01); G02F 1/133512 (2013.01); G02F 1/133784 (2013.01); H01L 21/02076 (2013.01); H01L 21/78 (2013.01); H01L 24/85 (2013.01); G02F 2202/105 (2013.01); G02F 2202/28 (2013.01);
Abstract

The present invention provides a method of unit level liquid crystal display device assembly process for liquid crystal on silicon. It starts with sawing silicon wafer and ITO glass substrate. Then good silicon dies and ITO glass dies will be picked and transferred to separate carriers. Alignment layers will respectively be coated on each silicon die and ITO glass die after cleaning. Then there are two options for the following steps. In method one, silicon die and ITO glass die lamination comes after coating frame adhesive. Then frame adhesive is cured. The liquid crystal will fill the cell and then seal the fill port. Die mounting, wire bonding and encapsulation will come along with external ITO connection to call it an end. In method two, frame adhesive precedes internal connection and LC one drop fill. Then silicon die and ITO glass die are laminated before frame adhesive cure. Afterwards die mount, wire bonding and encapsulation come last.


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