The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Oct. 14, 2011
Applicants:

Tjalf Pirk, Stuttgart, DE;

Thomas Wagner, Leonberg, DE;

Ando Feyh, Palo Alto, CA (US);

Georg Bischopink, Pliezhausen, DE;

Axel Franke, Ditzingen, DE;

Inventors:

Tjalf Pirk, Stuttgart, DE;

Thomas Wagner, Leonberg, DE;

Ando Feyh, Palo Alto, CA (US);

Georg Bischopink, Pliezhausen, DE;

Axel Franke, Ditzingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 21/02 (2006.01); G01C 19/5783 (2012.01); H01L 25/065 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
G01D 21/02 (2013.01); G01C 19/5783 (2013.01); H01L 25/0657 (2013.01); G01P 1/023 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73257 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.


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