The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Apr. 20, 2016
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Asako Hirai, Santa Barbara, CA (US);

Zhongyuan Jia, Goleta, CA (US);

Makoto Saito, Tsukuba, JP;

Hisashi Yamada, Tsukuba, JP;

Kenji Iso, Tsukuba, JP;

Steven P. DenBaars, Goleta, CA (US);

Shuji Nakamura, Santa Barbara, CA (US);

James S. Speck, Santa Barbara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 29/40 (2006.01); C30B 25/18 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/26 (2006.01); C30B 23/02 (2006.01); C30B 23/06 (2006.01); H01L 31/0304 (2006.01); H01L 31/036 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/16 (2010.01); H01L 33/32 (2010.01); C30B 25/20 (2006.01); C30B 29/60 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
C30B 29/406 (2013.01); C30B 23/025 (2013.01); C30B 23/066 (2013.01); C30B 25/18 (2013.01); C30B 25/186 (2013.01); C30B 25/20 (2013.01); C30B 29/403 (2013.01); C30B 29/60 (2013.01); H01L 21/0237 (2013.01); H01L 21/0243 (2013.01); H01L 21/0254 (2013.01); H01L 21/02389 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02565 (2013.01); H01L 21/02609 (2013.01); H01L 21/02617 (2013.01); H01L 21/02636 (2013.01); H01L 29/04 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/26 (2013.01); H01L 31/036 (2013.01); H01L 31/03044 (2013.01); H01L 31/1856 (2013.01); H01L 33/0075 (2013.01); H01L 33/16 (2013.01); H01L 33/32 (2013.01); H01S 5/34333 (2013.01); Y10T 428/24612 (2015.01);
Abstract

A nonpolar III-nitride film grown on a miscut angle of a substrate, in order to suppress the surface undulations, is provided. The surface morphology of the film is improved with a miscut angle towards an a-axis direction comprising a 0.15° or greater miscut angle towards the a-axis direction and a less than 30° miscut angle towards the a-axis direction.


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