The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Apr. 19, 2013
Applicant:

Dipsol Chemicals Co., Ltd., Tokyo, JP;

Inventors:

Manabu Inoue, Tokyo, JP;

Satoshi Yuasa, Chiba, JP;

Hitoshi Sakurai, Chiba, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 (2006.01); C25D 3/58 (2006.01); C22C 9/06 (2006.01); C22C 19/03 (2006.01); C22C 19/05 (2006.01);
U.S. Cl.
CPC ...
C25D 3/56 (2013.01); C22C 9/06 (2013.01); C22C 19/03 (2013.01); C22C 19/058 (2013.01); C25D 3/562 (2013.01); C25D 3/58 (2013.01);
Abstract

The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.


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