The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Sep. 18, 2014
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Junji Wakita, Otsu, JP;

Yukari Arimoto, Otsu, JP;

Masao Tomikawa, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); G02B 5/20 (2006.01); H01L 51/52 (2006.01); C09D 179/08 (2006.01); C08G 73/16 (2006.01); G02B 5/22 (2006.01); G03F 7/00 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1082 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1075 (2013.01); C08G 73/16 (2013.01); C09D 179/08 (2013.01); G02B 5/20 (2013.01); G02B 5/223 (2013.01); G03F 7/0007 (2013.01); H01L 27/322 (2013.01); H01L 51/0035 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 51/0097 (2013.01);
Abstract

The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.


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