The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jul. 01, 2013
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Joseph D. Rule, Cottage Grove, MN (US);

Scott M. Tapio, Falcon Heights, MN (US);

Audrey S. Sherman, Woodbury, MN (US);

Kevin R. Schaffer, Woodbury, MN (US);

Lan H. Liu, Rosemount, MN (US);

Margot A. Branigan, Roseville, MN (US);

Ross E. Behling, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); C09J 5/06 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B32B 7/06 (2013.01); B32B 17/06 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); C09J 5/06 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/31 (2013.01); B32B 2307/412 (2013.01); B32B 2551/00 (2013.01); C09J 2205/302 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24843 (2015.01);
Abstract

Heat de-bondable optical articles include two optical substrates and a heat de-bondable adhesive article disposed between them. The adhesive article includes a heat-shrinkable substrate and an optically clear adhesive proximate to the heat-shrinkable substrate. Optical articles can be prepared by disposing the heat-shrinkable substrate and the optically clear adhesive between two optical substrates. The optically clear adhesive covers a majority of the surface area of the optical substrates, and the heat-shrinkable substrate is located near the edge of the optical substrates.


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