The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Jun. 13, 2013
Applicant:
Ykk Corporation, Tokyo, JP;
Inventors:
Kazuya Mizumoto, Toyama, JP;
Tatsurou Nara, Toyama, JP;
Assignee:
YKK Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 175/04 (2006.01); B29C 45/16 (2006.01); A44B 19/00 (2006.01); A44B 19/42 (2006.01); A44B 19/24 (2006.01); B29C 45/00 (2006.01); B29C 45/47 (2006.01); B29D 5/00 (2006.01); B29K 77/00 (2006.01); B29K 105/12 (2006.01); B29K 309/08 (2006.01); B29L 5/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/16 (2013.01); A44B 19/00 (2013.01); A44B 19/24 (2013.01); A44B 19/42 (2013.01); B29C 45/0001 (2013.01); B29C 45/47 (2013.01); B29D 5/00 (2013.01); B29K 2077/00 (2013.01); B29K 2105/12 (2013.01); B29K 2309/08 (2013.01); B29K 2995/002 (2013.01); B29L 2005/00 (2013.01);
Abstract
A component for fasteners, including a molded component formed of a polyamide resin composition including reinforcing fiber, wherein a dyed layer being dyed inward from a surface of the molded component is disposed, and the thickness of the dyed layer is 30 to 100 μm.