The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Nov. 25, 2014
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Yongxing Yang, Shenzhen, CN;

Jian Zhang, Shenzhen, CN;

Shandang Liu, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 35/00 (2006.01); B23B 49/00 (2006.01); B23B 41/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
B23B 49/00 (2013.01); B23B 41/00 (2013.01); H05K 3/429 (2013.01); B23B 2228/36 (2013.01); B23B 2228/41 (2013.01); B23B 2260/128 (2013.01); B23B 2270/32 (2013.01); B23B 2270/48 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/163 (2013.01); Y10T 408/03 (2015.01); Y10T 408/173 (2015.01);
Abstract

The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.


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