The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Jan. 25, 2016
The Procter & Gamble Company, Cincinnati, OH (US);
Uwe Schneider, Cincinnati, OH (US);
Michael Devin Long, Springfield Township, OH (US);
David C. Ordway, Oxford, OH (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a second member. The first member and the second member may be separated by a repitch angle. The second member may be repositioned such that the first member and the second member are separated by a product angle. The first member may receive a leading portion and second member may receive a trailing portion of the substrate assembly and each member may rotate at the first velocity. The leading portion and the trailing portion are separated by a product arc length, which may be equal to a process product pitch. The substrate assembly may then undergo one or more processes such as bonding, cutting, and/or scoring.