The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Nov. 27, 2012
Applicant:

Taiwan Green Point Enterprises Co., Ltd., Taichung, TW;

Inventors:

Sheng-Hung Yi, Taichung, TW;

Pen-Yi Liao, Taichung, TW;

Min-Hsiang Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/24 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 1/0296 (2013.01); H05K 3/027 (2013.01); H05K 3/188 (2013.01); H05K 3/242 (2013.01); H05K 3/182 (2013.01); H05K 3/243 (2013.01); H05K 3/381 (2013.01); H05K 2201/0116 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01); H05K 2203/108 (2013.01); H05K 2203/175 (2013.01);
Abstract

A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.


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