The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Sep. 17, 2014
Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques
Applicant:
Heptagon Micro Optics Pte. Ltd., Singapore, SG;
Inventors:
Jukka Alasirniö, Jääli, FI;
Stephan Heimgartner, Passugg, CH;
Assignee:
Heptagon Micro Optics Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H04N 5/2252 (2013.01); H05K 3/284 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19105 (2013.01);
Abstract
Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.