The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Mar. 15, 2016
Applicant:

Edison Opto Corporation, New Taipei, TW;

Inventor:

Kuo-Feng Tseng, New Taipei, TW;

Assignee:

EDISON OPTO CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); H01L 25/0753 (2013.01);
Abstract

A light-emitting diode package element includes a substrate, a plurality of light-emitting dies arranged on the substrate, and a second wavelength-conversion layer. Some of the light-emitting dies are covered with first wavelength-conversion layers thereon, respectively. The first wavelength-conversion layers convert into light with a first color temperature. The second wavelength-conversion layer covers the substrate, the light-emitting dies, and the first wavelength-conversion layers, and converts into light with second color temperature different to the light with the first color temperature.


Find Patent Forward Citations

Tseng, Kuo-Feng. (2017). Light-emitting diode packaging element for controlling color temperature of lights (U.S. Patent No. 9825207). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9825207

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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