The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Feb. 16, 2017
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Tomohiko Sato, Nissin, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 29/739 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 23/367 (2013.01); H01L 29/0619 (2013.01); H01L 29/0696 (2013.01); H01L 29/41741 (2013.01); H01L 29/4236 (2013.01);
Abstract

A semiconductor device includes: a semiconductor substrate; a main electrode; a peripheral electrode; an insulating protective film; a surface metallic layer; and a solder layer, wherein the semiconductor substrate includes: a first region of a first conductive-type in contact with the main electrode on a main contact surface; a second region of a first conductive-type in contact with the peripheral electrode on a peripheral contact surface; and a third region of a second conductive-type provided under the first region, under the second region, and circumferentially outward of the second region, and a circumferentially-outward end of the metallic layer and a circumferentially-outward end of the solder layer are located more circumferentially inward than the circumferentially-outward end of the peripheral electrode.


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