The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Aug. 02, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Nam Goo Cha, Hwaseong-si, KR;

Yong Ii Kim, Seoul, KR;

Wan tae Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H05K 1/00 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H05K 1/00 (2013.01); H01L 33/505 (2013.01);
Abstract

A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.


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