The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Oct. 25, 2013
Applicant:
Ihp Gmbh—innovations for High Performance Microelectronics/leibniz-institut Fur Innovative Mikroelektronik, Frankfurt an der Oder, DE;
Inventors:
Zoya Dyka, Frankfurt, DE;
Peter Langendorfer, Frankfurt, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/528 (2006.01); H01L 27/118 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/53204 (2013.01); H01L 27/0292 (2013.01); H01L 27/11807 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device, in particular an integrated circuit with protection against side channel attacks, in particular imaging- and probing-based attacks, EMA and reverse engineering, in which a metallic conductive layer of a first () and/or a second potential supply line () are each connected directly and individually to all the circuit components via respective individual conductor path structures (V, V).