The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Jun. 27, 2014
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Chayathorn Saklang, Bangkok, TH;

Wiwat Tanwongwan, Bangkok, TH;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 24/46 (2013.01); H01L 23/49503 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/3512 (2013.01);
Abstract

Various aspects are directed to apparatuses, systems and related methods involving the mitigation of issues relating to thermal expansion and contraction of lead fingers of an integrated circuit package. Consistent with one or more embodiments, lead fingers on a leadframe substrate each have a locking structure that secures the lead finger in place relative to the substrate. The lead fingers provide a location to attach a bond wire to an integrated circuit, and connect the bond wire to terminals at a perimeter of the leadframe. The locking structure and arrangement of the lead fingers mitigate issues such as cracking or breaking of a solder connection of the bond wire to the leadframe, which can occur due to thermal expansion and contraction.


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