The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

May. 05, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Takayuki Kamiya, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/50 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 23/50 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01);
Abstract

An integrated circuit device comprises N stacked first integrated circuit chips each of which includes a first circuit and N stacked second integrated circuit chips each of which includes a second circuit. The N stacked second integrated circuit chips are stacked on the N stacked first integrated circuit chips. A first and second integrated circuit chips at symmetric positions with respect to a reference surface are paired. Each of the first and second integrated circuit chips include connection terminals for connecting the first circuit of the first integrated circuit chip and the second circuit of the second integrated circuit chip in the pair, and through electrodes each penetrating an inside of the chip. The connection terminals and through electrodes are arranged to be symmetric with respect to the reference surface.


Find Patent Forward Citations

Loading…