The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

May. 16, 2016
Applicant:

Caterpillar Inc., Peoria, IL (US);

Inventors:

William Mische, Chillicothe, IL (US);

Eric Andris, Dunlap, IL (US);

Basheer Qattum, Peoria, IL (US);

Daniel Sergison, East Peoria, IL (US);

Assignee:

Caterpillar Inc., Peoria, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 29/739 (2006.01); H01L 23/40 (2006.01); H01L 25/07 (2006.01); H02M 1/08 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 25/072 (2013.01); H01L 29/7393 (2013.01); H02M 1/08 (2013.01); H05K 5/03 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.


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