The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Nov. 09, 2016
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventor:
Andreas Voerckel, Villach, AT;
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H01L 21/82 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/76838 (2013.01); H01L 23/32 (2013.01); H01L 24/83 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83005 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.