The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Sep. 10, 2014
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Katsunori Shibuya, Mie, JP;
Takashi Imoto, Kamakura, JP;
Soichi Homma, Yokkaichi, JP;
Takeshi Watanabe, Yokkaichi, JP;
Yuusuke Takano, Yokkaichi, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/10 (2006.01); H01L 21/67 (2006.01); C23C 14/54 (2006.01); H01L 23/552 (2006.01); C23C 14/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67265 (2013.01); C23C 14/54 (2013.01); C23C 14/56 (2013.01); H01L 21/67259 (2013.01); H01L 21/67288 (2013.01); H01L 23/552 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/14 (2013.01);
Abstract
A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.