The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Nov. 09, 2012
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Motomune Kodama, Tokyo, JP;

Takashi Naito, Tokyo, JP;

Yuichi Sawai, Tokyo, JP;

Tadashi Fujieda, Tokyo, JP;

Takuya Aoyagi, Tokyo, JP;

Masanori Miyagi, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 3/21 (2006.01); C03C 3/12 (2006.01); C03C 8/08 (2006.01); C03C 8/02 (2006.01); C03C 8/24 (2006.01); C03C 8/14 (2006.01); H01L 21/48 (2006.01); B32B 7/02 (2006.01); B32B 7/04 (2006.01); B32B 27/06 (2006.01); C03C 8/18 (2006.01); C03C 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 27/06 (2013.01); C03C 3/122 (2013.01); C03C 3/21 (2013.01); C03C 8/02 (2013.01); C03C 8/08 (2013.01); C03C 8/18 (2013.01); C03C 8/24 (2013.01); C03C 23/0025 (2013.01); H01L 21/4807 (2013.01); B32B 2264/102 (2013.01); B32B 2307/30 (2013.01); B32B 2307/54 (2013.01); B32B 2457/14 (2013.01); Y10T 428/24942 (2015.01);
Abstract

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.


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