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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9824897 B1

PDFFull Text
Date of Patent:
Nov. 21, 2017

Filed:

Jul. 24, 2014

Thermal processing in silicon

Applicant:

Newsouth Innovations Pty Limited, Sydney, New South Wales, AU;

Inventors:

Brett Jason Hallam, Bexley, AU;

Matthew Bruce Edwards, Elanora Heights, AU;

Stuart Ross Wenham, Cronulla, AU;

Phillip George Hamer, Kensington, AU;

Catherine Emily Chan, Randwick, AU;

Chee Mun Chong, Bellevue Hill, AU;

Pei Hsuan Lu, Rockdale, AU;

Ly Mai, Sefton, AU;

Li Hui Song, Kingsford, AU;

Adeline Sugianto, Malabar, AU;

Alison Maree Wenham, Cronulla, AU;

Guang Qi Xu, Randwick, AU;

Assignee:

NEWSOUTH INNOVATIONS PTY LIMITED, Sydney, AU;

Attorneys:

Nathan S. Smith

McDermott Will & Emery LLP

Primary Examiner:

Cheung Lee

Int. Cl.
CPC ...
H01L 31/048 (2014.01); H01L 21/322 (2006.01); H01L 23/31 (2006.01); H01L 31/068 (2012.01); H01L 21/225 (2006.01); H01L 21/324 (2006.01); H01L 21/56 (2006.01); B32B 17/10 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3223 (2013.01); B32B 17/10036 (2013.01); B32B 17/10788 (2013.01); H01L 21/2253 (2013.01); H01L 21/324 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 31/048 (2013.01); H01L 31/0488 (2013.01); H01L 31/068 (2013.01); H01L 31/1804 (2013.01); H01L 31/1864 (2013.01); H01L 31/1868 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method is provided for the processing of a device having a crystalline silicon region containing an internal hydrogen source. The method comprises: i) applying encapsulating material to each of the front and rear surfaces of the device to form a lamination; ii) applying pressure to the lamination and heating the lamination to bond the encapsulating material to the device; and iii) cooling the device, where the heating step or cooling step or both are completed under illumination.

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