The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Aug. 01, 2014
Applicant:

Hitachi High-technologies Corporation, Yamaguchi, JP;

Inventors:

Akira Kagoshima, Kudamatsu, JP;

Daisuke Shiraishi, Hikari, JP;

Yuji Nagatani, Hikari, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/66 (2006.01); G05B 13/00 (2006.01); G05B 19/418 (2006.01); G05B 13/02 (2006.01); G05B 13/04 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3299 (2013.01); G05B 13/00 (2013.01); G05B 13/021 (2013.01); G05B 13/042 (2013.01); G05B 19/4184 (2013.01); H01J 37/32449 (2013.01); H01J 37/32926 (2013.01); H01J 37/32935 (2013.01); H01L 22/20 (2013.01); H01L 22/26 (2013.01); H01J 2237/3343 (2013.01);
Abstract

Method for carrying out plasma processing on a wafer under Run-to-Run control by using a plasma processing apparatus having a plasma processing chamber, a process monitor which monitors a condition in the plasma processing chamber, and an actuator which controls parameters which are constituent elements of a plasma processing condition. The method includes the steps of making one of the parameters a (N−1)th manipulated variable, calculating a first difference between a process monitor value in the plasma processing obtained by the process monitor and a desired value of the process monitor value in the plasma processing, calculating a correction amount of the (N−1)th manipulated variable on the basis of the first difference and a previously obtained correlation between the process monitor value in the plasma processing and the (N−1)th manipulated variable, wherein N is a natural number equal to or larger than 2.


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