The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Nov. 27, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shinya Sato, Osaka, JP;

Toshihisa Miura, Toyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/236 (2006.01); H01G 4/06 (2006.01); H01G 4/005 (2006.01); H01G 2/04 (2006.01); H01G 2/10 (2006.01); H01G 4/224 (2006.01); H01G 4/228 (2006.01); H01G 13/00 (2013.01);
U.S. Cl.
CPC ...
H01G 4/236 (2013.01); H01G 2/04 (2013.01); H01G 2/10 (2013.01); H01G 2/103 (2013.01); H01G 4/005 (2013.01); H01G 4/06 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01); H01G 13/003 (2013.01); H01G 13/006 (2013.01); Y10T 29/51 (2015.01);
Abstract

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.


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