The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Aug. 16, 2012
Applicants:

Dongshe Zhang, Carlsbad, CA (US);

Aziz S. Shaikh, San Diego, CA (US);

Srinivasan Sridharan, Strongsville, OH (US);

Himal Khatri, Vista, CA (US);

Hong Jiang, Irvine, CA (US);

George E. Graddy, Jr., Del Mar, CA (US);

Inventors:

Dongshe Zhang, Carlsbad, CA (US);

Aziz S. Shaikh, San Diego, CA (US);

Srinivasan Sridharan, Strongsville, OH (US);

Himal Khatri, Vista, CA (US);

Hong Jiang, Irvine, CA (US);

George E. Graddy, Jr., Del Mar, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01B 1/22 (2006.01); C07F 9/11 (2006.01); C03C 8/16 (2006.01); C03C 8/18 (2006.01); C03C 8/22 (2006.01); H01L 31/0224 (2006.01); H01L 21/22 (2006.01); C03C 8/10 (2006.01); C03C 8/08 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C03C 8/08 (2013.01); C03C 8/10 (2013.01); C03C 8/16 (2013.01); C03C 8/18 (2013.01); C03C 8/22 (2013.01); C07F 9/11 (2013.01); H01L 21/2225 (2013.01); H01L 31/022425 (2013.01); H01L 31/022441 (2013.01); Y02E 10/50 (2013.01);
Abstract

Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.


Find Patent Forward Citations

Loading…