The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Dec. 06, 2016
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Declan Macken, Eden Prairie, MN (US);

Jon Karsten Klarqvist, Roseville, MN (US);

Assignee:

SEAGATE TECHNOLOGY LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/02 (2006.01); G11B 11/00 (2006.01); G11B 5/48 (2006.01); G11B 7/1263 (2012.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4853 (2013.01); G11B 5/4866 (2013.01); G11B 7/1263 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A slider of a heat-assisted recording head comprises electrical bond pads coupled to bias sources and a ground pad, an air bearing surface, and a waveguide configured to receive light from a laser source. A contact sensor proximate the air bearing surface is coupled between a first bond pad and a second bond pad. A bolometer is coupled to a reference thermal sensor. The bolometer is situated at a slider location that receives at least some of the light communicated along the waveguide. The reference thermal sensor is situated at a slider location unexposed to the light communicated along the waveguide. The bolometer and reference thermal sensor are coupled between the first and second bond pads and in parallel with the contact sensor. A ground connection is coupled to the ground pad and at a connection between the bolometer and the reference thermal sensor.


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