The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Mar. 30, 2016
Applicant:

Lenovo (Beijing) Limited, Beijing, CN;

Inventor:

Cuicui Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F28D 15/00 (2006.01); F28F 3/04 (2006.01); F28F 13/00 (2006.01); F28F 21/08 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); F28D 15/00 (2013.01); F28F 3/042 (2013.01); F28F 13/003 (2013.01); F28F 21/083 (2013.01); F28F 21/084 (2013.01); F28F 21/085 (2013.01); H05K 7/20154 (2013.01); H05K 7/20254 (2013.01); H05K 7/20436 (2013.01); F28D 2021/0028 (2013.01);
Abstract

Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.


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