The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Apr. 21, 2015
Applicant:

Korea Research Institute of Standards and Science, Daejeon, KR;

Inventors:

Kwon-Kyu Yu, Daejeon, KR;

Yong-Ho Lee, Daejeon, KR;

Kiwoong Kim, Daejeon, KR;

Hyukchan Kwon, Daejeon, KR;

Jin-Mok Kim, Daejeon, KR;

Sang-Kil Lee, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); G01R 33/00 (2006.01); A61B 5/05 (2006.01); G01R 33/035 (2006.01); G01R 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01); H01L 39/02 (2006.01); A61B 5/04 (2006.01);
U.S. Cl.
CPC ...
G01R 33/007 (2013.01); A61B 5/05 (2013.01); G01R 1/18 (2013.01); G01R 33/035 (2013.01); G01R 33/0354 (2013.01); H01L 23/367 (2013.01); H01L 23/473 (2013.01); H01L 39/02 (2013.01); A61B 5/04005 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An apparatus and a method for indirectly cooling a superconducting quantum interference device (SQUID) are provided. The apparatus includes an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar.


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