The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Feb. 06, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); C23C 18/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1603 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1643 (2013.01); B41J 2/1628 (2013.01); B41J 2002/14491 (2013.01); Y10T 428/24488 (2015.01);
Abstract
A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion.