The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Jun. 19, 2015
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Tommy Marx, Santa Barbara, CA (US);

Richard E. Bornfreund, Santa Barbara, CA (US);

Yaroslava Petraitis, Ventura, CA (US);

James L. Dale, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); H01J 37/34 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0042 (2013.01); C23C 14/0063 (2013.01); C23C 14/08 (2013.01); C23C 14/083 (2013.01); C23C 14/3485 (2013.01); H01J 37/3411 (2013.01); H01J 37/3429 (2013.01); H01J 37/3467 (2013.01); H01J 2237/3323 (2013.01);
Abstract

A system is disclosed, including a processing chamber for a deposition process; a cathode within the chamber, configured to introduce a sputter gas and a reactive gas adjacent to a target; a substrate holder, disposed opposite the cathode within the processing chamber, configured to secure a substrate to receive a deposition from the target; and a control system configured to monitor a target voltage and to control a flow rate of the reactive gas to maintain the target voltage within a desired range during the deposition process. Methods and devices for deposition processes are also disclosed.


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