The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
May. 29, 2014
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Masanori Yamazaki, Yokohama, JP;
Mari Abe, Yokohama, JP;
Tomohide Murase, Yokohama, JP;
Yasuhiro Kawase, Kitakyushu, JP;
Makoto Ikemoto, Kitakyushu, JP;
Hideki Kiritani, Chiyoda-ku, JP;
Yasunori Matsushita, Yokkaichi, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin. A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles which have a specific surface area of at least 10 m/g, the surface of which is constituted by boron nitride primary particles having an average particle size of at least 0.05 μm and at most 1 μm, and which are spherical, and a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s.