The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Nov. 06, 2015
Applicant:
Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;
Inventors:
Takayuki Chujo, Hiki-gun, JP;
Arata Endo, Hiki-gun, JP;
Assignee:
TAIYO INK MFG. CO., LTD., Hiki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C08J 5/18 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); H05K 1/0271 (2013.01); H05K 1/0373 (2013.01); H05K 3/4676 (2013.01); C08J 2363/00 (2013.01); H05K 3/429 (2013.01); H05K 2203/0537 (2013.01); H05K 2203/0783 (2013.01);
Abstract
An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.