The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Jul. 24, 2014
Applicant:

Blue Cube Ip Llc, Midland, MI (US);

Inventors:

Simon Ye, Shanghai, CN;

Tianhui Xiao, Shanghai, CN;

Hongyu Chen, Shanghai, CN;

Michael J. Mullins, Midland, MI (US);

Yu Cai, Shanghai, CN;

Jiawen Xiong, Shanghai, CN;

Joey W. Storer, Midland, MI (US);

Mark B. Wilson, Midland, MI (US);

Frank Y. Gong, Shanghai, CN;

Assignee:

BLUE CUBE IP LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/42 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); C09D 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4238 (2013.01); C08G 59/4261 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C08J 2363/00 (2013.01); C08J 2425/08 (2013.01);
Abstract

Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.


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