The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Jun. 20, 2016
Applicant:
Sitime Corporation, Sunnyvale, CA (US);
Inventors:
Pavan Gupta, Belmont, CA (US);
Aaron Partridge, Cupertino, CA (US);
Markus Lutz, Mountain View, CA (US);
Assignee:
SiTime Corpoaration, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 23/34 (2006.01); B81C 1/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0083 (2013.01); B81B 7/007 (2013.01); B81B 7/0077 (2013.01); B81C 1/0023 (2013.01); B81C 1/00301 (2013.01); B81C 1/00333 (2013.01); B81C 1/00341 (2013.01); H01L 23/34 (2013.01); H01L 23/498 (2013.01); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01); B81B 2207/094 (2013.01); B81C 2201/016 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01);
Abstract
In a microelectromechanical system (MEMS) device, a CMOS die is affixed to a die-mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is stacked on and electrically coupled to the CMOS die in a flip-chip configuration. A package enclosure envelopes the MEMS die, CMOS die and wire bonds, and exposes respective regions of the electrically conductive leads.
Gupta, Pavan. (2017). Stacked-die mems resonator system (U.S. Patent No. 9821998). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9821998
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile