The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
May. 30, 2012
Kiyotaka Nakamura, Kirishima, JP;
Yoshio Ohashi, Satsumasendai, JP;
Yuuichi Abe, Satsumasendai, JP;
Eisuke Hirano, Satsumasendai, JP;
Kunihide Shikata, Kirishima, JP;
Keiichi Sekiguchi, Satsumasendai, JP;
Kiyotaka Nakamura, Kirishima, JP;
Yoshio Ohashi, Satsumasendai, JP;
Yuuichi Abe, Satsumasendai, JP;
Eisuke Hirano, Satsumasendai, JP;
Kunihide Shikata, Kirishima, JP;
Keiichi Sekiguchi, Satsumasendai, JP;
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Abstract
A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.